C-3568BQ Overview
Chapter 1 Product Overview
The C-3568BQ V1.0 core board uses the Rockchip RK3568B2 (Cortex-A55x4) quad-core processor, ships with Android 11, and runs at up to 2.0 GHz. It delivers outstanding performance with rich interfaces, top-tier benchmark and decode results, and is a new choice for human-machine interaction and industrial-control projects.
1.1 Scope of application
The C-3568BQ V1.0 is a high-performance, low-power core board based on the Rockchip RK3568B2 processor. It is widely applicable to smart-display terminals, video terminals, and industrial-automation terminals — such as advertising players, digital signage, smart self-service terminals, smart retail terminals, O2O smart devices, industrial-control hosts, robotic equipment, and more.
1.2 Product features
- Rich display interfaces: integrates HDMI / LVDS / MIPI / eDP display interfaces and supports multi-screen display.
- Uses four 80-pin BTB connectors to bring out every pin function, enabling flexible expansion designs.
- Integrates PCIe3.0, dual GMAC, SDIO, I2C, I2S, PWM, UART, and GPIO interfaces to meet the requirements of various peripherals on the market.
- Supports dual-screen asymmetric display. LVDS supports up to 1920×1200, and eDP supports up to 2560×1600.
- Built-in deep neural-network unit (NPU) delivering 1.0 TOPS, meeting the needs of deep-learning projects.
1.3 Appearance and interface diagram
Front:
Back:
Photo notice
The photos above were taken of a board from one of our production batches. Because the product is under continuous maintenance, the board actually shipped may not match the photos exactly.
Chapter 2 Basic feature list
| Feature | Description |
|---|---|
| Board size | 65*45mm |
| CPU | RK3568B2, quad-core (Cortex-A55x4), up to 2.0 GHz |
| OS | Harmony OS / Android 11.0 |
| Memory | Supports 4 GB LPDDR4 memory |
| Storage | Supports 32 GB, 64 GB, and 128 GB eMMC storage options |
| Display | 1× HDMI, up to 1080P@60Hz 1× MIPI, up to 1080P@60Hz 1× eDP, up to 2560×1600 |
| Connectivity | 2× internal gigabit Ethernet MAC 1× PCIe3.0 X2 lane RC 1× PCIe2.0 X1 lane RC up to 3× UART up to 4× I2C up to 1× SPI up to 2× SDIO |
| Board-to-board connector | 80P 0.5mm pitch B2B connector ×4 |
| Operating temperature | -10°C to 60°C |
Chapter 3 PCB dimensions and interface layout
3.1 PCB dimensions
- PCB: 8-layer board, 1.6 mm thick
- PCBA: L × W = 65 mm × 45 mm, MAX H = 7.0 (??) +/- 0.3 mm
- Screw hole spec: M2 × 4
3.2 Interface parameter notes
Image annotation: the circle on the socket-interface image 
indicates pin 1.
BTB interface (80pin / 0.5mm × 4)
Chapter 4 Electrical performance
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