M4-R1 Introduction
1 Product Overview
1.1 Scope of Application
ShimetaPi M4-R1 V1.0 belongs to the ShimetaPi series mainboards. The RK3568B2 chip it uses is a low-power, high-performance processor widely applicable to video-class terminal products, industrial automation terminals, and computing terminal products, such as smart self-service terminals, O2O smart devices, industrial control hosts, robot equipment, and so on.
1.2 Appearance and Interface Diagram
Front:
Back:
Front view:
Photo Statement
The above photos were taken from a board produced in one of our production batches. Because the product is under continuous maintenance, the boards actually shipped may not be completely identical to the photos.
2 Basic Function List
| Function | Description |
|---|---|
| Board Size | 110*73mm |
| CPU | Rockchip RK3568B2;<br>quad-core 64-bit Cortex-A55; up to 2.0GHz |
| GPU | ARM G52 2EE;<br>supports OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1;<br>embedded high-performance 2D acceleration hardware |
| NPU | Supports 1Tops computing power |
| OS | Open-source OpenHarmony |
| Memory / Storage | Standard 4GB + 32GB |
| Display Interface | 1 × HDMI, up to 4K@60Hz resolution<br>1 × MIPI, can directly drive MIPI-interface LCDs of various resolutions (720×1280 verified)<br>1 × eDP, can directly drive eDP-interface LCDs of various resolutions (1920×1080 verified) |
| MIPI Input | 1 channel, supports up to 8MP |
| Headphone Output | 1 channel, supports three/four-pole headphone insertion |
| Ethernet | 2 × Gigabit Ethernet (1000Mbps) |
| WIFI&BT | Built-in Wi-Fi, supports Bluetooth 4.2 |
| USB Interface | 1 × USB3.0 OTG <br>1 × USB3.0 HOST<br>2 × USB2.0 HOST |
| Serial Port | 1 × TTL<br>1 × Debug_UART |
| I2C Interface | 3 × I2C, can connect I2C-interface TP or peripherals |
| Raspberry Pi Interface | 1 × 40PIN, 2*20PIN pin-header, 2.0mm pitch |
| Storage | Supports USB flash drive and TF card for storage expansion |
| RTC | Supports low-power operation |
| System Upgrade | Supports local USB upgrade |
| key | 1 × POWER ON button;<br>1 × Uboot burn button |
| LED | 2 channels, user-programmable indicators |
3 PCB Size and Interface Layout
3.1 PCB Size Diagram
PCB: 8-layer board, 1.6mm thickness
PCBA: L _ W = 110mm _ 73mm
Screw hole spec: ∮3.0mm x 4
Notes: 1. Thermal design
- Subject to actual product dimensions
3.2 Interface Parameter Description
Image annotation explanation: On socket connector images, the circled area
indicates pin 1, and the red connector's
indicates pin 1.
3.2.1 Power Input (6pin/1.0mm)
(1) Function Description:
The board is powered by a 5V DC supply; it is only allowed to be powered from the Type-C USB connector and the 6pin1.0mm power socket. With no peripherals connected (no-load), the 5V DC supply must support a minimum current of 1000mA.
(2) Electrical Definition:
| No. | Definition | Attribute | Description | |
|---|---|---|---|---|
| 1 | 5V | Input | 5V input | |
| 2 | 5V | Input | 5V input | |
| 3 | 5V | Input | 5V input |  |
| 4 | GND | Ground | Ground | |
| 5 | GND | Ground | Ground | |
| 6 | GND | Ground | Ground | |
3.2.2 MIC Interface (2pin/1.25mm)
(1) Function Description:
The mainboard has one MIC interface for connecting an external microphone.
(2) Electrical Definition:
| No. | Definition | Attribute | Description | |
|---|---|---|---|---|
| 1 | MIC+ | Input | MIC+ |  |
| 1 | MIC- | Input | MIC- | |
Notes:
1. Pay attention to the polarity of the MIC connection; do not reverse it. 2. With no peripherals connected (no-load), the 5V DC supply must support a minimum current of 1000mA.
3.2.3 RTC Interface (2pin/1.25mm)
(1) Function Description:
The mainboard has a 2pin 1.25mm-pitch wafer socket interface used to power the system clock when the main power is off.
(2) Electrical Definition:
| No. | Definition | Attribute | Description | |
|---|---|---|---|---|
| 1 | RTC | Input | 3V input |  |
| 2 | GND | Ground | Ground | |
Notes:
1. When using the RTC battery, pay attention to the correct polarity. Reverse insertion may cause a short circuit, creating a risk of fire and explosion. 2. If you find the RTC time is inaccurate during use, please replace the RTC battery in time. Use a correct 3V CR2036 coin cell. If you need to use a battery with a wire, please contact FAE for the corresponding model specification.
3.2.4 DEBUG Serial Port Interface (4pin/1.0mm)
(1) Function Description:
Used for RK3588 system log print output and uart Debug.
(2) Electrical Definition:
| No. | Definition | Attribute | Description | |
|---|---|---|---|---|
| 1 | GND | Ground | Ground |  |
| 2 | UART-RX | Input | RX2 | |
| 3 | UART-TX | Output | TX2 | |
| 4 | NC | --- | No connection | |
Notes:
1. Verify that the TX and RX connections are correct. 2. The serial port print baud rate defaults to 1500000bps. 3. If the level of the connected serial port is higher than 3.3V, an isolation circuit or level-shift circuit must be used; otherwise the main controller and the device will be damaged.
3.2.5 FAN Interface (4pin/1.0mm)
(1) Function Description:
The board has one fan interface that supports 5V fans and PWM speed control.
(2) Electrical Definition:
| No. | Definition | Attribute | Description | |
|---|---|---|---|---|
| 1 | 5V | Power | 5V power |  |
| 2 | PWM | Output | Fan speed control | |
| 3 | GND | Ground | Ground | |
| 4 | NC | --- | No connection | |
Notes:
1. When installing the fan, verify that the pin definitions match.
3.2.6 TP Interface (10pin/0.5mm)
(1) Function Description:
The board supports connecting an I2C-interface TP (touch panel) screen. The interface is a 10pin 0.5mm-pitch vertical FPC socket.
(2) Electrical Definition:
| No. | Definition | Attribute | Description | |
|---|---|---|---|---|
| 1 | GND | Ground | Ground |  |
| 2 | GND | Ground | Ground | |
| 3 | RST | I/O | Reset | |
| 4 | INT | I/O | Interrupt | |
| 5 | GND | Ground | Ground | |
| 6 | SCL | I/O | I2C clock | |
| 7 | SDA | I/O | I2C data | |
| 8 | VCC | Power | 3.3V output | |
| 9 | GND | Ground | Ground | |
| 10 | GND | Ground | Ground | |
Notes:
1. The board supports I2C-interface TP screens. Before connecting, confirm whether the touchscreen interface is I2C or USB. 2. The I2C, RST and INT signal levels on this interface are 3.3V. If you connect a 1.8V-level touchscreen, level shifting is required. 3. Before connecting, verify that the pin order electrical definitions match. Connect the touchscreen before powering on; hot-plugging is not allowed.
3.2.7 MIPI Interface (40pin/0.5mm)
(1) Function Description:
Supports connecting a MIPI screen. The interface is a 40pin 0.5mm-pitch vertical FPC socket.
(2) Electrical Definition:
| No. | Definition | Attribute | Description | |
|---|---|---|---|---|
| 1 | VDD_1V8 | Power | 1.8V input |  |
| 2 | VDD_3V3 | Power | 3.3V input | |
| 3 | VDD_3V3 | Power | ||
| 4 | NC | NC | NC | |
| 5 | Reset | Output | Screen reset signal, high level 3.3V | |
| 6 | NC | NC | NC | |
| 7 | GND | Ground | Ground | |
| 8 | MIPI_D0N | Output | MIPI Port Lane 0 negative output | |
| 9 | MIPI_D0P | Output | MIPI Port Lane 0 positive output | |
| 10 | GND | Ground | Ground | |
| 11 | MIPI_D1N | Output | MIPI Port Lane 1 negative output | |
| 12 | MIPI_D1P | Output | MIPI Port Lane 1 positive output | |
| 13 | GND | Ground | Ground | |
| 14 | MIPI_CKN | Output | MIPI Port clock negative output | |
| 15 | MIPI_CKP | Output | MIPI Port clock positive output | |
| 16 | GND | Ground | Ground | |
| 17 | MIPI_D2N | Output | MIPI Port Lane 2 negative output | |
| 18 | MIPI_D2P | Output | MIPI Port Lane 2 positive output | |
| 19 | GND | Ground | Ground | |
| 20 | MIPI_D3N | Output | MIPI Port Lane 3 negative output | |
| 21 | MIPI_D3P | Output | MIPI Port Lane 3 positive output | |
| 22 | GND | Ground | Ground | |
| 23 | NC | NC | NC | |
| 24 | NC | NC | NC | |
| 25 | GND | Ground | Ground | |
| 26 | NC | NC | NC | |
| 27 | NC | NC | NC | |
| 28 | NC | NC | NC | |
| 29 | NC | NC | NC | |
| 30 | GND | Ground | Ground | |
| 31 | LED- | Power | LCD backlight power - | |
| 32 | LED- | Power | ||
| 33 | NC | NC | NC | |
| 34 | NC | NC | NC | |
| 35 | NC | NC | NC | |
| 36 | NC | NC | NC | |
| 37 | NC | NC | NC | |
| 38 | NC | NC | NC | |
| 39 | LED+ | Power | LCD backlight power + | |
| 40 | LED+ | Power | ||
Notes:
1. The default current setting is 40mA.
3.2.8 MIPI Camera Interface (22pin/0.5mm)
(1) Function Description:
The board supports 1 channel of mipi camera input. The interface is a 22pin 0.5mm-pitch vertical FPC socket.
(2) Electrical Definition:
| No. | Definition | Attribute | Description | |
|---|---|---|---|---|
| 1 | GND | Ground | Ground |  |
| 2 | D0N | I/O | mipi data lane 0 negative | |
| 3 | D0P | I/O | mipi data lane 0 positive | |
| 4 | GND | Ground | Ground | |
| 5 | D1N | I/O | mipi data lane 1 negative | |
| 6 | D1P | I/O | mipi data lane 1 positive | |
| 7 | GND | Ground | Ground | |
| 8 | CLKN | I/O | mipi clock lane negative | |
| 9 | CLKP | I/O | mipi clock lane positive | |
| 10 | GND | Ground | Ground | |
| 11 | D2N | I/O | mipi data lane 2 negative | |
| 12 | D2P | I/O | mipi data lane 2 positive | |
| 13 | GND | Ground | Ground | |
| 14 | D3N | I/O | mipi data lane 3 negative | |
| 15 | D3P | I/O | mipi data lane 3 positive | |
| 16 | GND | Ground | Ground | |
| 17 | PWREN | Output | Power enable control | |
| 18 | GPIO | Output | Reserved IO, undefined | |
| 19 | GND | Ground | Ground | |
| 20 | SCL | Output | SCL signal | |
| 21 | SDA | I/O | SDA signal | |
| 22 | VDD | Power | 3.3V output | |
Notes:
1. The maximum supported resolution is 9.4MP. 2. The signal levels of I2C, RST and other signals on this interface are 1.8V. If you connect a 3.3V-level module, level shifting is required. 3. Before connecting, verify that the pin order electrical definitions match. Connect the module before powering on; hot-plugging is not allowed.
3.2.9 EDP Interface (30pin/0.5mm, back side)
(1) Function Description:
Supports connecting an EDP screen. The interface is a 30pin 0.5mm-pitch FPC socket.
(2) Electrical Definition:
| No. | Definition | Attribute | Description | |
|---|---|---|---|---|
| 1 | NC | -- | No connection |  |
| 2 | GND | Ground | Ground | |
| 3 | D1- | Output | Display Port Lane 1 negative output | |
| 4 | D1+ | Output | Display Port Lane 1 positive output interrupt | |
| 5 | GND | Ground | Ground | |
| 6 | D0+ | Output | Display Port Lane 0 negative output | |
| 7 | D0- | Output | Display Port Lane 0 positive output | |
| 8 | GND | Ground | Ground | |
| 9 | AUX+ | Output | Display Port AUX+ chanenl positive singal | |
| 10 | AUX- | Output | Display Port AUX- chanenl negative singal | |
| 11 | GND | Ground | Ground | |
| 12 | PVCC | Power | eDP LCD power output 3.3V | |
| 13 | PVCC | Power | eDP LCD power output 3.3V | |
| 14 | NC | - | No connection | |
| 15 | GND | Ground | Ground | |
| 16 | GND | Ground | Ground | |
| 17 | eDP_HPD | Input | Hot-plug detect signal, screen output | |
| 18 | GND | Ground | Ground | |
| 19 | GND | Ground | Ground | |
| 20 | GND | Ground | Ground | |
| 21 | GND | Ground | Ground | |
| 22 | BL-EN | Output | Backlight enable control | |
| 23 | BL-PWM | Output | Backlight brightness PWM control | |
| 24 | NC | -- | No connection | |
| 25 | NC | -- | No connection | |
| 26 | VLED | Power | 5V output | |
| 27 | VLED | Power | 5V output | |
| 28 | VLED | Power | 5V output | |
| 29 | VLED | Power | 5V output | |
| 30 | NC | -- | No connection | |
3.2.10 IO Interface (40pin/2.54mm)
(1) Function Description:
The IO provides control-signal input/output for peripherals; the level is 3.3V. The IO can connect Raspberry Pi peripheral devices.
(2) Electrical Definition:
| No. | Definition | Attribute | Description | |
|---|---|---|---|---|
| 1 | 3V3 | Power | 3.3V output |  |
| 2 | 5V | Power | 5V output | |
| 3 | SDA | I/O | I2C3_SDA signal | |
| 4 | 5V | Power | 5V output | |
| 5 | SCL | I/O | I2C3_SCL signal | |
| 6 | GND | Ground | Ground | |
| 7 | GPIO | I/O | GPIO4_D2 | |
| 8 | TX | Output | TTL-TX3 | |
| 9 | GND | Ground | Ground | |
| 10 | RX | Input | TTL-RX3 | |
| 11 | GPIO | I/O | GPIO1_B0 | |
| 12 | GPIO | I/O | IO_PWM0_M0 | |
| 13 | GPIO | I/O | GPIO1_B1 | |
| 14 | GND | Ground | Ground | |
| 15 | GPIO | I/O | GPIO0_A1 | |
| 16 | GPIO | I/O | GPIO1_B2 | |
| 17 | 3V3 | Output | 3.3V output | |
| 18 | GPIO | I/O | GPIO2_D7 | |
| 19 | MOSI | Input | SPI_MOSI signal | |
| 20 | GND | Ground | Ground | |
| 21 | MISO | Output | SPI_MISO signal | |
| 22 | GPIO | I/O | GPIO3_B1 | |
| 23 | SCLK | Output | SPI_CLK signal | |
| 24 | CE0 | Output | SPI_CS0 signal | |
| 25 | GND | Ground | Ground | |
| 26 | CE1 | Output | SPI_CS1 signal | |
| 27 | GPIO | I/O | I2C5_SDA | |
| 28 | GPIO | I/O | I2C5_SCL | |
| 29 | GPIO | I/O | GPIO0_C5 | |
| 30 | GND | Ground | Ground | |
| 31 | GPIO | I/O | IO1_5 | |
| 32 | PWM0 | Output | PWM signal | |
| 33 | PWM1 | Output | PWM signal | |
| 34 | GND | Ground | Ground | |
| 35 | GPIO | I/O | IO1_1 | |
| 36 | GPIO | I/O | GPIO3_C5 | |
| 37 | GPIO | I/O | IO1_2 | |
| 38 | GPIO | I/O | IO1_3 | |
| 39 | GND | Ground | Ground | |
| 40 | GPIO | I/O | IO1_4 | |
Notes:
1. The IO level of peripherals must not exceed 3.3V. If the connected device's IO level is higher than 3.3V, an isolation circuit or level-shift circuit must be used; otherwise the main controller and the device will be damaged. 2. When using IO pins, pay attention to whether the IO pin is an input or an output. 3. Note if peripherals draw power through this IO (when powered off, measuring this IO with a multimeter should read 0V).
3.2.11 POE Interface (2pin/2.0mmX2 pin-header)
(1) Function Description:
This interface can connect an external POE daughter board.
(2) Electrical Definition:
| No. | Definition | Attribute | Description | |
|---|---|---|---|---|
| 1 | GND1（3-6） | Input | Common tap of RJ45_pair3-6 |  |
| 2 | 48V1（1-2） | Input | Common tap of RJ45_pair1-2 | |
| 3 | GND2（7-8） | Input | Common tap of RJ45_pair7-8 | |
| 4 | 48V2（4-5） | Input | Common tap of RJ45_pair4-5 | |
Notes:
1. On the POE power supply market there are standard POE and non-standard POE (the difference is that standard POE transmits data and current over all four pairs 1-2-3-6 simultaneously; non-standard POE transmits data over 1-2-3-6 and current over 4-5-7-8). If you choose a non-standard POE module, it cannot adapt to standard POE switch-powered equipment; if you choose a standard POE module, it can accept non-standard POE power input. 2. It is recommended that the external POE module support the IEEE802.3af/at standard; you can ask FAE for the corresponding model specification. 3. The board supports a maximum power input of 30W. If many high-power peripherals are connected to the board, it is recommended to take power from the DC socket.
3.3 Other Standard Interfaces and Functions
| Interface | Standard | Parameter Description |
|---|---|---|
| Storage Interface | TF Card | Adopts the SD3.0 interface specification; supports up to Class10, with a minimum write/read speed of 10MB/s and a maximum capacity of 128GB |
| USB TYPE-A | USB 2.0, up to 480Mbps/s transfer rate (60MB/s); USB 3.0, up to 5.0Gbps/s transfer rate (500MB/s) | |
| Ethernet Interface | RJ45 | Supports 10/100/1000M wired networks |
| HDMI Interface | HDMI TYPE-A | HDMI 1.4, 2.0; supports multiple resolutions such as 1920x1080, 1280x720, 720x576, 720x480 |
| Headphone Interface | 3.5mm | Supports left/right dual channels and MIC recording |
4 Electrical Performance
| Item | Min | Typical | Max | |
|---|---|---|---|---|
| Power Parameters | Voltage | -- | 5V | -- |
| Ripple | -- | -- | 50mV | |
| Current | 3A | |||
| Power Current (HDMI output, no other peripherals) | Operating Current | 500mA | 1200mA | |
| Standby Current | 300mA | 450mA | ||
| Total Output | Current | -- | -- | 3A |
| Environment | Relative Humidity | -- | -- | 80% |
| Operating Temperature | 0℃ | -- | 60℃ | |
| Storage Temperature | -40℃ | 80℃ | ||
5 Whole-Device Minimum Test Items
Description:
| Minimum Items for Whole-Device Stability and Reliability Testing | ||
|---|---|---|
| No. | Test Item | Detailed Test Description |
| 1 | Basic Function Performance Test | Test the main functional performance of the whole device, including Wi-Fi, Bluetooth, Ethernet, USB, serial port, video playback, and other functions |
| 2 | Software Upgrade Function Test | Verify the whole-device product upgrade function. Test respectively whether line flashing, USB flash drive upgrade, and network remote upgrade function normally |
| 3 | High-Temperature Aging Test | Test the device's high-temperature resistance. After playing an aging video for 3 days in a 60℃ environment, the device runs normally without freezes, screen anomalies, black screens, or other electrical defects |
| 4 | Low-Temperature Power-Off Test | Test the device's low-temperature resistance. After playing an aging video for 3 days in a 0℃ environment, the device runs normally without freezes, screen anomalies, black screens, or other electrical defects |
| 5 | Short-Term Scheduled Power On/Off at Room Temperature | Test the device's ability to withstand power cycling: program 3 minutes off, 7 minutes on. After 7 days of operation the device runs normally without freezes, screen anomalies, black screens, or other electrical defects; the abnormal-event record probability does not exceed 4/10000 |
| 6 | Electrostatic Discharge (ESD) Test | Simulated test to evaluate the product's ability to defend against electrostatic discharge. Per the IEC 61000-4-2 test standard recommendation, apply contact ±4KV and air ±8KV discharges. The product verification must meet Class A or Class B to be accepted; Class C and Class D are unacceptable |
| 7 | Sine Sweep Vibration Test | Test the product's vibration resistance through simulated transport testing and the solder/parts endurance on the board to avoid potential problems. Test the product with a vibration tester. After the test, the sample has no loose or fallen structure and can run normally, with no freezes, screen anomalies, black screens, electrical defects, or structural/cosmetic damage — judged OK |
| 8 | Free Fall Drop Test | Simulate the device's ability to withstand drops during transport and handling, used to judge the machine's structural endurance, avoid potential issues, and inform design and process improvements. After the test the sample runs normally, with no freezes, screen anomalies, black screens, electrical defects, or structural/cosmetic damage — judged OK |
| 9 | Short-Term Power-Loss Surge at Room Temperature | Test the device's ability to withstand power cycling through this test |
| 10 | Long-Term Scheduled Power On/Off at Room Temperature | Verify the stability of the MCU and of the system operation. The scheduled on/off tool is set to power on at 09:30 and power off at 18:30. The log records each power-on with equal time intervals; on-time and off-time error is less than 1 min — judged qualified |
| 11 | Over-Voltage / Under-Voltage Test | Per the Android board's power supply spec, detect the board's voltage tolerance through voltage variation. Test the whole device for 2 hours under -20% / +30% rated supply. During and after the test the sample runs normally without freezes, screen anomalies, black screens, or other electrical defects — judged OK |
6 Configurable Parameter Table (Differences)
7 Usage Precautions (Must Read)
Tips
You can download related materials such as 03-Product Specifications, 04-Hardware Materials, etc. via Downloads for more detailed information.
PS: Software, tools, source code, etc. used in subsequent documents can be found in Downloads!
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